Manufacturing yield is a critical metric in the semiconductor manufacturing industry, as it directly impacts the profitability and success of companies. To effectively manage and improve manufacturing yield, companies rely on yield management solutions and yield enhancement systems. The Reporting & Analysis module discussed here plays a vital role in this regard by providing production yield reports to various stakeholders, including product, manufacturing, and yield engineers.
Simplifying Report Generation
One of the key features of this module is its ability to simplify and automate the generation of production yield reports. With over 300 standard reports available, engineers and analysts can easily access the information they need for daily monitoring and improvement projects. This eliminates the need for writing complex scripts or spending hours probing databases and data warehouses. By streamlining the reporting process, the module saves valuable time and effort for engineering teams.
Integration and Data Analysis
The module enables seamless integration of manufacturing data, allowing engineers to drill down into the data for in-depth analysis. In case of anomalies or deviations from expected yield levels, engineers can investigate further to identify the root causes. This ability to dive into the data empowers engineers to take prompt corrective actions and prevent yield losses.
Proactive Monitoring with Triggers
To enhance the proactive nature of semiconductor yield management, the Reporting & Analysis module supports the use of triggers. These triggers can be set based on predefined yield targets, statistical bin limits, or other metrics relevant to the manufacturing process. When a trigger condition is met, the module automatically generates a set of reports, alerting the engineering team about potential manufacturing anomalies or process excursions. This feature enables proactive monitoring and enables early intervention to prevent yield degradation.
Stakeholder Benefits
The module serves various stakeholders within a semiconductor manufacturing company. Engineering management and analysts can leverage the module for manufacturing requirements planning, order management, and conducting quarterly business reviews with supply chain partners. Additionally, internal staff and business reviews can be facilitated using the module’s reporting capabilities.
Engineers, on the other hand, rely on the module for a wide range of tasks. They can use it to establish benchmark “baseline” numbers for yield improvement initiatives or test pattern reduction projects. The module also enables engineers to monitor yield consistency and detect any drifts that may lead to larger yield losses. By analyzing yield abnormalities and using commonality analysis techniques, engineers can identify common attributes that contribute to yield variations and address them effectively. Furthermore, the module aids engineers in identifying test fallout that could be captured at the wafer test stage through appropriate virtual tests.
Insights from Wafer Probe and Final Test Yield Reports
Wafer probe and final test yield reports and charts are of particular importance to engineers. These reports provide crucial insights into cost, consistency, and uniformity across the wafer fab and test operations. Engineers can optimize costs by analyzing correlations between wafer probe and final test yields along with other variables, such as bin yields. The classic fail bin Pareto report assists yield engineers in ranking failure types over time, enabling them to prioritize their efforts in reducing defect rates. By drilling down further into the reports, engineers can focus on addressing the root causes of failures, be they related to the fab process, assembly, or test issues. This module fosters collaboration between engineers and fab equipment engineers to resolve yield issues by providing actionable information.
Wafer Map Software for Geospatial Analysis
The module also offers wafer map software that enables engineers to perform geospatial analysis of wafer data. Engineers can view bin and parametric-based maps to identify yield issues within specific wafer zones, such as the edge of the bull’s eye portion of the wafer. These maps can be combined with defect image data from inspection steps, providing additional insights into possible macro-identified issues like scratches or discolorations. This integration of wafer map analysis and defect image data helps engineers in pinpointing the sources of yield variations and taking corrective actions accordingly.
Validating Test Program Effectiveness with Bin Correlation Reports
Bin correlation reports play a crucial role in the test program release process. Engineers can compare pass/fail numbers between new and prior test programs using reference units. Any changes in the pass/fail numbers can be identified and analyzed through bin correlation reports. These reports are essential for validating the detection capability of newly added tests in the test program. By running a set of units with both the new and prior test programs, engineers can assess the effectiveness of the new test and ensure its alignment with the desired quality standards.
Enhancing Accuracy in Electrical Performance Analysis
As the semiconductor industry has witnessed the transition from smaller wafer sizes to larger ones, such as 150mm to 200mm and 300mm, the variation in electrical performance across a wafer has increased. Traditional methods of averaging electrical results from a typical five-site Process Control Monitor (PCM) have become less accurate. To overcome this challenge, the Reporting & Analysis module provides the capability to break down a wafer into zones for more precise analysis. Engineers can utilize PCM data from the nearest zone to perform correlation analysis, ensuring accurate assessment and understanding of electrical performance variations across the wafer.
Conclusion
In summary, the Reporting & Analysis module offers a comprehensive set of tools and features tailored to the needs of the semiconductor manufacturing industry. By providing production yield reports, simplifying report generation, and enabling data integration and analysis, the module enhances yield management and optimization efforts. It empowers engineers to proactively monitor yield, identify anomalies, and take corrective actions promptly. Through its capabilities in wafer map analysis, bin correlation reports, and detailed yield analysis, the module facilitates efficient yield enhancement, quality improvement, and cost optimization in semiconductor manufacturing processes.
References:
- Lee, T., & Yu, J. (2019). Yield Management Solutions for the Semiconductor Industry. Journal of Semiconductor Technology and Science, 19(1), 1-9.
- Chien, C. F., & Lee, S. C. (2015). Yield Enhancement for Semiconductor Manufacturing. John Wiley & Sons.
- Weng, K. S., Su, M. C., & Kao, M. C. (2020). Design and implementation of semiconductor yield management system. Journal of Electronic Science and Technology, 18(1), 42-51.
Hsu, K. Y., Liu, Y. C., & Tsai, T. T. (2017). Yield enhancement system for semiconductor manufacturing using data mining techniques. Journal of Manufacturing Systems, 43, 145-153.